- Overview
- COM-HPC
- COM Express
- SMARC
- Qseven
- ETX \ XTX
 
COM-HPC
                    
                        COM-HPC is the next-generation computer-on-module, defined with 800pin, two new 400pin board to board connectors. The increment of pin assignment for power input and I/O interface makes it possible to support more powerful computing unit, memory capacity up to 1TB; and upgrade bandwidth to support next generation high-speed interfaces, such as PCIe Gen5 (32GT/s), USB4 (40Gbps), and 25Gb Ethernet. These features meet the growing demands for data processing and transmission. Coming with Server and Client pinout types, and five board sizes, COM-HPC is adaptable to the future use of edge computing in 5G network environment.
                        
                     
                    COM-HPC Form Factor
                    
                        COM-HPC comes with two types of interface schemes and 5 board sizes to serve different classes of embedded applications in the edge. COM-HPC Server is recommended to design with board size D & E, headless applications and 4~8pcs of long DIMM sockets for ultimate memory expansion, while COM-HPC Client is recommended to design with board size A, B & C, providing displays and can be integrated with 2 to 4 SODIMM sockets that relative low profile.
                        
                     
                    COM-HPC Function Per Pinout
                    
                    COM-HPC vs. COM Express
                    
                        COM-HPC offers large scale of form factors to complement spectrum of COM Express. It also provides more performance and super speed expansions for future I/O bandwidth. Refer to the comparison chart of board size and function support list.
                        Board size
                        COM-HPC enlarges board size, so that Size D and E can support 4~8pcs of long DIMM sockets that COM Express cannot realize because of physical limit. 
Here are the dimension comparison of COM-HPC and COM Express.
                        
                        Function support list
                        Compared to COM Express, COM-HPC can support 65 lanes of PCI Express connectivity up to Gen5 (32GT/s) speed, 4 ports of USB4 (40Gbps) or USB 3.2 Gen 2x2 (20Gbps), 8 ports of 25GBase-KR with sideband signal and more low speed I/O pins for function communication.
                        
                        Difference of the board to board connector
                        COM-HPC defines 800pin with two new designed 400pin board to board connectors for incremental pin assignment and optimized bandwidth; while COM Express defines one or two 220pin connectors for specific pinout types.