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MIOE-DB2100
Evaluation Board for MIO-3260
MIOe-230
48-bit LVDS or DisplayPort1 , 2 x USB 2.0
MIOe-220
3 x Intel® Gigabit Ethernet
MIOe-210
4 x RS232/422/485, 2 x RS422/485, 8-bit GPIO
MIOe-120
2 x GbE, HDMI, Mini PCIe, SIM holder, speaker out, LPC, 2 x USB 2.0
 
 
arr Latest News

Advantech MIO-2270 High-Performance 2.5” MI/O-Ultra Pico-ITX Single-Board Computer for Graphically Intensive Applications

Date: 2/2/2015 12:00:00 AM

Feburary 2, 2015, Taipei – Advantech, a leading embedded platform and total solutions provider, is pleased to announce the launch of  MIO-2270 - a low power SBC solution with quad-core processor based on the AMD® G-Series eKabini System-on-Chip (SoC). Its 2.5” Pico-ITX MI/O-Ultra (100 x 72 mm) form factor accommodates a quad-core processor for delivering enhanced graphics and superior system performance. MIO-2270 features rich I/O to support various medical, gaming, and signage applications. MIO-2270 can be used stand alone, or it can be expanded using the MIOe expansion slot on the bottom side to support additional interface modules that give more flexible support.

Outstanding Graphics Performance with Low Power Consumption
MIO-2270 is integrated with an AMD® Radeon™ HD8330Egraphics controller and enhanced Universal Video Decoder (UVD 4.2) to support H.264, MPEG4, VC-1, MVC, MPEG2, OpenGL 4.1, OpenCL 1.2, andDirectX 11.1. MIO-2270 also features dual-view compatibility through HDMI 1.4a (up to 1920 x 1200) or legacy VGA interface (up to 2048 x 1536) and 18-bit LVDS. Compared to the Intel® Atom Processor E3800 Product Family, MIO-2270 offers a 70% improvement in graphics performance and 150% improvement in multimedia performance. Power consumption at full loading is only 9 to 15 watts, ensuring that MIO-2270 satisfies customer needs for low power consumption with high graphics performance.

Compact Thermal Solution for System Integration
MIO-2270 was designed to be compact and low profile. The total height of the device combined with a passive heatsink and AMD® G-Series eKabini GX-210JA dual-core SoC is approximately 34 mm. The total height when combined with a low-profile cooler and AMD® G-Series eKabini GX-415GA quad-core SoC is 41 mm. Therefore, this device is suitable for height-restricted chassis designs. Besides the standard passive heatsink and active cooler, an optional heat spreader thermal solution is available. Direct contact between the heat spreader and metal case ensures good heat dissipation with a more compact system design. Thus, for slim chassis designs, the inclusion of a heat spreader is ideal.

Highly Reliable Design for Embedded Applications
MIO-2270 features a single 12 V DC power input design with +/- 10% tolerance and supports DC power hot-plug protection to prevent fluctuations in DC voltage from damaging the board. For increased reliability and endurance in extreme environments, MIO-2270 complies with IEC standards for electrostatic discharge protection, ensuring 15KV air gap protection for the COM port transceiver, and 8KV contact protection for RS-232 pins. Featuring 100% solid capacitors with superior MTBF, a TG-170-type PCB, and a transient voltage suppressor for ESD/electrical fast transient (EFT) power protection, MIO-2270 is a well-designed reliable single-board computer that can withstand high operating temperatures.

Industrial Cloud Computing Client with SUSIAccess
MIO-2270 supports industrial cloud-based services with the inclusion of SUSIAccess. SUSIAccess is a remote maintenance platform with active management capabilities developed for monitoring connected intelligent systems. Using software programs stored in an industrial cloud, users can instantly identify equipment malfunctions, conduct real-time maintenance, and ensure enhanced system security remotely, significantly improving operational efficiency and reducing time and personnel demands. SUSIAccess also facilitates powerful utilities such as System Recovery (powered by Acronis), System Protection (powered by McAfee), and Remote KVM to protect against and recover from potential system failures.

Key Features

  • 2.5” MI/O-Ultra series (Pico-ITX form factor): 100 x 72 mm (3.9" x2.8").
  • AMD® G-Series eKabini dual-core GX-210JA 1.0GHz and quad-core GX-415GA 1.5GHz SoC.
  • Compared to AMD G-Series APU, improves performance by up to 20% and offers DirectX® 11.1 graphics support.
  • Dual independent displays, either VGA or HDMI with 18-bit LVDS; MIOe supports additional DP interfaces for flexible implementation.
  • Supports DDR3 1.5V and DDR3L 1.35V 1066/1600 MHz SODIMM memory (up to 8 GB).
  • Rich I/O interface with two USB3.0, two USB2.0, one GbE, two COM, one SATA (6 Gbps), and one 8-bit GPIO ports, as well as one HD audio line-in/out, SMBus, half-size mSATA, and half-size mini PCIe. Both mSATA and mini PCIe support the USB interface communication module.
  • MIOe expansion slot supports extended interfaces: DisplayPort or HDMI, two PCIe x1, LPC, SMBus, USB 2.0, HD audio line-out, 5 VSB/12 VSB power, and power ON/OFF/Reset functions.
  • Wide operating temperature range of 0 ~ 60 °C (32 ~ 140 ˚F).
  • Supports Windows CE7.0, Windows 7, WES7, Windows 8/8.1, Windows XP/XP Embedded, and Linux.
  • Supports Advantech’s SUSIAccess and embedded Software API and Utility.

For more information regarding MIO-2270 or the new MI/O extension form factor, please contact your local sales office, or visit the Advantech website at http://www.advantech.com.tw/embcore/mio_extension_sbc.aspx.